Description
USAGE:
The machine is used in cutting for CVL/FPC/RF and thin multilayer board, as well as cutting a variety of substrates,such as ceramic, silicon, aluminium foil, teflon etc.
FEATURES:
(1)Slight carbonization :
Carbonization is much weaker compared with nanosecond laser processing.
(2)Faster speed:
Processing speed increased several times compared with nanosecond processing.
(3)Cutting effect:
The processing surface is more smooth, neat, clean;
(4)More applications:
In addition to the traditional circuit board polymer and copper foil processing, picosecond can also process ceramics, silicon,Teflon and other materials.
(5)High intelligent :
Support EMCS, MES system. Automatically choose the cutting graphics unit by using identification of 2D bar code .
SPECIFICATIONS
| Specification of picosecond laser cutting machine | ||
| Applied Range | FPC,CVL,FPC, micro-connection, ceramics, silicon and so on | |
| System Processing Accuracy | ( ZHENGYE Conditions) ±20μm |
|
| Laser power | 15W@400kHz | |
| Laser Wavelength | 355nm | |
| Pulse Width | 10ps | |
| Frequency Range | 4kHz-1MHz | |
| Objects | Large processing size | 550mmX650mm |
| Table number | Single beam, Dual platform | |
| Dimensions (L×W×H) | 2200mm×2150mm×1750mm | |
| Weight | 3700kg | |
Cutting Examples:
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