The machine is used in cutting for CVL/FPC/RF and thin multilayer board, as well as cutting a variety of substrates,such as ceramic, silicon, aluminium foil, teflon etc.
(1)Slight carbonization :
Carbonization is much weaker compared with nanosecond laser processing.
Processing speed increased several times compared with nanosecond processing.
The processing surface is more smooth, neat, clean;
In addition to the traditional circuit board polymer and copper foil processing, picosecond can also process ceramics, silicon,Teflon and other materials.
(5)High intelligent :
Support EMCS, MES system. Automatically choose the cutting graphics unit by using identification of 2D bar code .
|Specification of picosecond laser cutting machine|
|Applied Range||FPC,CVL,FPC, micro-connection, ceramics, silicon and so on|
|System Processing Accuracy||( ZHENGYE Conditions)
|Objects||Large processing size||550mmX650mm|
|Table number||Single beam, Dual platform|
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