Pico Second Laser Cutting Machine Cutting for Cvl FPC RF

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SKU: JG32 Category:

Description

USAGE:

The machine is used in cutting for CVL/FPC/RF and thin multilayer board, as well as cutting a variety of substrates,such as ceramic, silicon, aluminium foil, teflon etc.

FEATURES:

(1)Slight carbonization : 
Carbonization is much weaker compared with nanosecond laser processing.

(2)Faster speed: 
Processing speed increased several times compared with nanosecond processing.

(3)Cutting effect: 
The processing surface is more smooth, neat, clean;

(4)More applications: 
In addition to the traditional circuit board polymer and copper foil processing, picosecond can also process ceramics, silicon,Teflon and other materials.

(5)High intelligent : 
Support EMCS, MES system. Automatically choose the cutting graphics unit by using identification of 2D bar code .

SPECIFICATIONS
 

Specification of picosecond laser cutting machine
Applied Range FPC,CVL,FPC, micro-connection, ceramics, silicon and so on
System Processing Accuracy  ( ZHENGYE Conditions)
±20μm
 Laser power 15W@400kHz
 Laser Wavelength 355nm
Pulse Width 10ps
Frequency Range 4kHz-1MHz
Objects Large processing size 550mmX650mm
Table number Single beam, Dual platform
Dimensions (L×W×H)  2200mm×2150mm×1750mm
Weight  3700kg

Cutting Examples:

 

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